Published On: Wed, Oct 19th, 2016

Recently Changed Price Targets On Kulicke And Soffa Industries, Inc. (NASDAQ:KLIC)


A number of investment brokers have recently updated their price targets on shares of Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC).

Most recent broker ratings

07/09/2015 – Kulicke and Soffa Industries, Inc. was upgraded to “buy” by analysts at Singular Research. They now have a USD 16.5 price target on the stock.

06/25/2015 – Kulicke and Soffa Industries, Inc. had its “hold” rating reiterated by analysts at TheStreet.

01/07/2015 – Kulicke and Soffa Industries, Inc. was upgraded to “outperform” by analysts at Zacks. They now have a USD 14.6 price target on the stock.

11/05/2014 – Kulicke and Soffa Industries, Inc. had its “buy” rating reiterated by analysts at D.A. Davidson. They now have a USD 18 price target on the stock.

07/30/2014 – Kulicke and Soffa Industries, Inc. had its “buy” rating reiterated by analysts at B. Riley. They now have a USD 17.5 price target on the stock.

The share price of Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) was down -0.69% during the last trading session, with a day high of 13.16. 154528 shares were traded on Kulicke and Soffa Industries, Inc.’s last session.

The stock’s 50 day moving average is 12.68 and its 200 day moving average is 12.18. The stock’s market capitalization is 910.29M. Kulicke and Soffa Industries, Inc. has a 52-week low of 9.57 and a 52-week high of 13.44.

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.